Keep Cool, Control Costs, Clock Exceptional Speeds
Need forward-thinking thermal solutions that meet next-gen pluggable IO thermal requirements right this minute? Attend live demonstrations to explore Molex’s latest innovations at DesignCon Booth #739.
Our advanced offerings facilitate air-cooled architectures while controlling overall expense— eliminating the need for potentially pricier liquid cooling. Designed for today’s 112G IO requirements and beyond, these leading-edge options enable thermal improvement of +5oC over traditional heatsinks and 30W+ of air-cooled efficiency … without increasing fan speed/power. Sound smart? Our customers think so, too.
Test and Measurement That Goes the Extra Mile
Digital advances in data analytics, machine learning (ML) and the Internet of Things (IoT) are spurring cutting-edge machinery innovations in robotics, aeronautics and more—and with this level of speed and complexity, there’s no room for testing errors in real time. That’s why Molex offers a complete line of high-performance RF cable assemblies, adapters and components for all your test and measurement needs. These versatile solutions are made with low-density PTFE to deliver propagation velocities of 76%, outstanding phase and amplitude stability, and dependable performance at up to 110 GHz speeds. Visit us at DesignCon Booth #739 for tailored recommendations.
Can’t wait for DesignCon 2023? Check out the design innovations below.