High-Speed Interconnect Solutions to Meet Next-Generation Hyperscale and Enterprise Data Center Demands

Molex’s broad portfolio of next-generation connectivity solutions leverage the latest advancements in copper and optics to deliver high signal integrity, lower latency and reduced insertion loss for optimal efficiency, speed and density.

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“Collaborating with Molex on next-generation interconnect innovations and reference designs enables us to meet evolving customer needs. Innovium’s highly power efficient 32-port 800G TERALYNX® 8 switch leverages Molex’s pluggable QSFP-DD800 modules and BiPass I/O technology to drive better performance and operational efficiencies while benefiting customers with the delivery of pre-tested and pre-validated reference designs.”

  • Amit Sanyal, VP of Marketing, Innovium

Skyrocketing Demand for Bandwidth-Intensive, Data-Driven Services

Gartner expects end-user spending on global data center infrastructure to reach $200 billion this year, as large enterprise facilities resume expansion while hyperscalers continue to expand globally. Additionally, skyrocketing demand for bandwidth-intensive, data-driven services, which accelerated during COVID-19, is fueling a rise in compute, data storage and networking capabilities. To keep pace, companies are moving from monolithic data center designs to distributed and disaggregated architectures, which creates significant connectivity challenges.

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Skyrocketing Demand for Bandwidth-Intensive, Data-Driven Services

“There is no such thing as ‘one size fits all’ interconnect technologies to support different applications across today’s enterprise and hyperscale data centers,” said Aldo Lopez, president, Datacom Solutions, Molex. “We offer our customers and ecosystem partners the broadest portfolio of future-proof interconnect solutions, which ease transitions to new architectures and simplify engineering development while reducing costs and time to market.”

Driving Copper Innovations with New 112G AEC Cables

Molex has added the new 112G Active Electrical Cables (AEC) to its line of copper interconnect solutions that extend link reach at higher data rates. AEC increases reach up to five meters without requiring optical cables while also supporting smaller conductors for improved cable management. AEC can also support gearbox capabilities as well as smart cable functionality for adding an extra measure of system-level redundancy.

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Driving Copper Innovations with New 112G AEC Cables

This latest addition to the Molex copper interconnect family joins Active Copper Cable (ACC), which works just like passive cable to extend the reach of external cabling and supports low-power linear amplifier-based semiconductors for improved power management and thermal needs.

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Delivering Best-In-Class Signal Integrity with BiPass

Molex’s industry-leading BiPass technology, delivers best-in-class signal integrity with multiple near-ASIC connector solutions, including TGA and the NearStack family of connectors.  Molex’s vertical BiPass implementation offers industry-leading thermal performance and low-power requirements, which let datacenters reduce their carbon footprints. BiPass also provides low latency for end-to-end channel performance while lowering TCO by reducing printed circuit board (PCB) costs.

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“Celestica has developed a wide range of end-to-end infrastructure systems that support powerful datacenter solutions. In collaborating with Molex, we are propelling the industry forward with our development of the first reference switches to use Molex’s vertical BiPass implementation, delivering the thermal and signal-integrity performance needed for 112G systems.”

– Randy Clark, Sr. Director, Product Solutions, Celestica

Meeting Changing Data Center Landscape with 100G Optical Transceivers

Molex is driving industry-wide efforts to increase adoption of 100G and 400G optical links and module technologies. The company is ramping deployment of a complete range of 100G per lambda transceivers for high-performance data center, cloud and wireless connectivity.

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Meeting Changing Data Center Landscape with 100G Optical Transceivers

As part of its customer-centric and partner-focused activities, Molex supports a full IEEE- and MSA-compliant portfolio and product roadmap to meet both intra-data center interconnect, and data center interconnect requirements. The expanding optical transceiver family includes 100G-DR, 100G-FR, 100G-LR, 400G-DR4 (500m and 2km), 400G-FR4, 400G-LR4, 400G-ZR and 400G-ZR+ as well as 800G roadmap products.

Molex’s pluggable optical transceiver models all benefit from the company’s vertical-integration expertise in silicon photonics, photonic integration, module assembly and packaging. Together, these integrated capabilities and experience enable Molex to deliver optimized data rates and low power consumption in a small form factor.

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Design & Manufacturing Insights

Automation Advancement: Tools that Move the Needle

In engineering and operational contexts, efficiency is often represented as a percentage. But efficiency is also an imperative for progress and innovation. Being more efficient really has no limits because what may be 100% efficient today can only ever be measured against what the current solutions can provide to drive that efficiency. When new technology is introduced, efficiency has to be reassessed because technology is constantly evolving. Thus, what may have been viewed as 100% efficient a year ago may be considered considerably less efficient by today’s standards.

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Telecommunications Insights

10 Tech Enablers That Are Turning 5G into Reality

5G represents the next generation of wireless communications with the exciting prospects of higher capacity, lower latency, and increased bandwidth.  However, getting to the point of applying 5G at scale has predictably taken longer than some expected. Here, Molex makes a timely assessment of 10 critical technology enablers that go a long way to making 5G a reality.

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