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Mirror Mezz Pro Mezzanine Connectors

Molex is honored that the Open Compute Project’s Open Accelerator Infrastructure (OAI) group has selected the Mirror Mezz Pro as the board-to-board mezzanine connector standard for the Open Accelerator Module (OAM) v1.5. This latest addition to the Mirror Mezz Connector family offers up to 270 differential pairs, delivers superior signal integrity performance and supports data speeds up to 112 Gbps for telecommunications, networking and other high-density applications.

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Selected as the Mezzanine Connector Standard for OAM v1.5

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Mirror Mezz Pro 112 Gbps Mezzanine Connectors

The Open Compute Project was founded to create commodity hardware that supports companies as they transition their infrastructure to meet today’s connectivity demands. The Mirror Mezz Pro Mezzanine Connector delivers 112-Gbps data rates, high density and a hermaphroditic design, and the Open Compute Project’s OAI group has selected it as the mezzanine connector standard for the OAM v1.5.

Compactness and Density

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Mirror Mezz Pro 112 Gbps Mezzanine Connectors

Space savings on PCB real estate can translate into lower applied cost with high-volume production over an extended period of time. The Mirror Mezz Pro Connector has the same high-density footprint as existing Mirror Mezz products.

112 Gbps Data Rates

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Mirror Mezz Pro 112 Gbps Mezzanine Connectors

With chips becoming more advanced and data rates increasing, this connector is designed to fulfill data requirements for both existing and future programs.

Mirror Mezz Pro 112 Gbps Mezzanine Connectors
Product Features Advantages
Hermaphroditic design
  • Requires a single part number for a mated set, simplifying the bill of materials (BOM) and inventory management.
Dense pin field with up to 270 differential pairs (DPs) and 107 to 115 DPs per square inch
  • Provides high density in space-constrained applications.
Same footprint as standard Mirror Mezz products
  • Supports implementation of Mirror Mezz Pro Connectors.
Robust blind mating guidance and pin shrouding features
  • Protects contact tips from stubbing and other risks of damage
  • Provides a 0.70mm float range to aid alignment in blind mating applications
  • Designed to pass the “thumb test” (i.e., running a thumb over the terminals, which will not bend due to protection provided by the housing)
Stitched ball grid array (BGA) design
  • Offers more cost savings than insert-molded BGA attachments
  • Delivers a familiar termination method for CMs and ODMs (same as legacy processor sockets)
  • Provides a low profile as compared to other termination methods
“Stubless” contact interface
  • Supports superior signal integrity (SI) performance
  • Provides a minimum stack height of 5.00mm
  • Delivers connectivity reliability with two points of contact on every beam
Opposing Beam Support
  • Offers full support for mated beams at mated condition
  • Supports maximum disengagement with close-to-rigid cantilever
  • 1.50mm maximum wipe, 0.15mm back off
Pitch: contact vs. solder paddle
  • Pitch varies between contacts and “paddles” to optimize impedance through the channel (4.00mm DP pitch).
Different paddle-to-contact bend direction between the rows
  • Minimizes the cross-talk between rows