The IEEE International Microwave Symposium (IMS) is the key annual international meeting for technology experts involved in all aspects of the booming microwave business. Molex is planning another extensive IMS presence, led by our diverse selection of RF/Microwave connectors and cable assemblies, in booth 1911 this year. Molex has been growing its RF/Microwave portfolio, both by making key acquisitions and developing new products, so we have a lot to talk about.
Molex subject matter experts will showcase, display and provide expert commentary on a range of innovative and reliable interconnect products at IEEE 2016, which will be held May 22 – 27 at The Moscone Center in San Francisco. We’ll be highlighting our line of more than 90 RF connector interface types, Temp-Flex® specialty wire and cable products, and the SDP Telecom product portfolio, which ranges from complex surface mount passive microwave structures to sophisticated sub-assemblies and integrated subsystems. As a result, Molex will feature a very wide range of applications, from I/O to radar, automotive, specialty cable, and cellular communications.

Several Molex products will be showcased at the booth, including Multi-Port 50 and 75 ohm connectors for multiple RF channel applications and Temp-Flex® Foam-Core Ultra-Low-Loss Coaxial Microwave Cable, which provides both customized and off-the-shelf options. In addition, we will focus on our range of SMPM and SMP RF Connectors, which offer high-density, high-frequency solutions with tight board-to-board spacing.