PACK EXPO Las Vegas is around the corner, and as always there will be some great learning and networking opportunities. We at Molex are looking forward to showcasing new innovations, products and applications. In booth S-5925, Molex experts will be on-hand to discuss up and coming technologies in the packaging machine, robot manufacturing and system integration markets as well as assist with any questions that you may have. In addition to sharing our knowledge and resources, we enjoy this show because it gives us a chance to find out what others in the industry are working on and where their challenges are.

Molex remains committed to providing the best for our customers. We’ve recently made several key acquisitions, such as GWconnect® heavy duty connectors and Flamar. Those acquisitions, and others, are adding to our ability to offer complete solutions for intelligent, on-machine control systems.

We also have several soon-to-be released products to preview, including an M23 Overmolded connector for motors, PROFINET IO-Link Portfolio, EtherNet/IP Safety I/O, and EtherNet/IP Roller Drive I-O. In addition, we’ve added to our Brad® Micro-Push® M12 connectors, our Brad® Industrial Ethernet Solutions, and our SST Ethernet and Serial Communication Modules.

We’re really looking forward to meeting with our customers, exploring the showroom floor and sharing our knowledge. PACK EXPO, slated for September 28-30 in Las Vegas. Please stop by and visit us at the Molex booth S-5925. Let’s get the conversation started!